Trymax Semiconductor Equipment has completed the installation of its 500th process chamber in Asia, reflecting ongoing demand for the company's plasma and UV-based semiconductor manufacturing equipment in the region.
The company's growth spans several Asian markets, including China, Taiwan, South Korea, Malaysia, and the Philippines. This development is in line with Trymax's stated target of reaching 1,000 global installations by the end of 2025.
Peter Dijkstra, Chief Commercial Officer at Trymax Semiconductor Equipment, commented on the company's achievement: "Reaching 500 installations in Asia is a significant milestone for Trymax. It reflects our team's dedication to delivering practical, high-performance solutions with the speed and reliability that our customers need in order to stay competitive."
Trymax has developed a reputation for responsiveness throughout the customer engagement process, from initial inquiry to after-sales support. The company attributes this to its organisational structure, which enables rapid action and decision-making. According to client feedback, many customer partnerships have continued due to efficient communication and prompt support.
Semiconductor manufacturing in Asia is growing in response to increased demand across several sectors. In the automotive industry, for example, a shift from internal combustion engine vehicles to electric vehicles requires more semiconductors per unit—sometimes up to 3,000 chips per vehicle—driven by increased electrification, power management, and embedded computing. This development is cited as a growth area for the company's high-throughput processing solutions.
The rise of artificial intelligence (AI) and machine learning is another contributing factor. Demand for advanced microprocessors and high-density memory to support AI applications is growing, and equipment reliability in semiconductor backend processes is necessary for yield and performance. Trymax's plasma and UV curing products are positioned for these requirements, addressing ashing, descum, surface cleaning and activation, and isotropic etching steps.
The accelerated rollout of 5G networks across Asia, coupled with heavy data consumption and a mobile-oriented population, is further fuelling semiconductor demand. Advanced packaging technologies and the need for increased wafer-level precision support a requirement for reliable backend processing capabilities.
In support of its continued expansion in Asia, Trymax is assessing options for establishing local manufacturing in China. The company says this will help to bolster its supply chain and enhance responsiveness to customers in the region.
As part of its strategy for 2025–2030, Trymax intends to build on its partnerships with major semiconductor manufacturers. The company will focus on undertaking selective, non-core process steps, particularly in backend wafer processing. This approach is described as enabling manufacturers to allocate internal resources to core activities while maintaining operational focus.
Trymax is also extending its activities in advanced packaging as integrated circuit designs become more layered, sometimes reaching up to 16 layers. Reliable processing between layers, including maintaining clean and activated surfaces, is a requirement for yield and reliability—something the company says its plasma solutions can help fulfil.
The company will present its latest plasma-based technologies at SEMICON Southeast Asia 2025 at the Sands Expo and Convention Centre in Singapore, with the aim of showcasing its technical plans and growth trajectory to the wider industry.
