ADLINK unveils rugged Intel edge AI modules for robots

ADLINK has launched its first computer-on-module based on Intel Core Ultra Series 3 processors, targeting industrial edge AI systems that need on-device acceleration and extended temperature operation.

The product, called Express-PTL, uses Intel's Panther Lake H-series silicon and the COM Express form factor. ADLINK positions the module for embedded deployments where designers want a compact compute block that pairs CPU processing with integrated AI and graphics engines.

AI compute

ADLINK said the module delivers up to 180 TOPS of combined AI compute across the CPU, GPU and NPU. The company said the NPU 5.0 delivers up to 50 TOPS and the integrated Intel Xe3 GPU delivers up to 120 TOPS for AI tasks.

The module supports up to 16 CPU cores. ADLINK described a hybrid CPU arrangement with 4 performance cores, 8 efficiency cores and 4 low-power efficiency cores.

The company also highlighted graphics and system integration considerations. It said the Intel Arc GPU includes up to 12 Xe cores, which it said simplifies system integration for graphics-heavy use cases.

Memory and I/O

Express-PTL supports up to 128 GB of DDR5 SO-DIMM memory. ADLINK said certain SKUs include IBECC memory support. It also listed TSN Ethernet among options aimed at industrial deployments.

ADLINK described a higher bandwidth PCIe interface for add-in accelerators. The company linked this to low-latency interaction between processors and external accelerators.

Rugged SKUs

ADLINK said it will offer industrial-temperature variants rated from -40°C to 85°C. It also listed features aimed at industrial use, including TCC, TSN, In-Band ECC, and extended temperature support.

The company said some SKUs align with FuSa and FSEDP requirements. It positioned these options for deployments it described as mission-critical and rugged.

Target uses

ADLINK cited medical imaging and infotainment among graphics-intensive applications for the module. It also pointed to autonomous robots, including humanoids and quadrupeds, and said the module suits navigation, object recognition and real-time decision-making.

The company also named industrial automation and outdoor systems as target areas. It said the module's extended temperature support fits edge deployments exposed to severe temperature changes.

Roadmap products

Alongside Express-PTL, ADLINK set out a broader set of Intel Core Ultra Series 3-based embedded products. It named COM-HPC-mPTL, SBC35-PTL and MXE-330 as additions to its embedded portfolio.

ADLINK said COM-HPC-mPTL will use a COM-HPC Mini format. It described a 95 mm x 70 mm module size and said the module integrates CPU, NPU and GPU in one unit. ADLINK also said this model uses soldered-down memory.

The company tied the soldered memory approach to environments with vibration, shock and extreme temperatures. It also said these designs focus on footprint and system power.

ADLINK described SBC35-PTL as a 3.5-inch single board computer. It described MXE-330 as an edge computing platform. For both, it said an Adaptive Function Module design allows custom I/O configurations and connectivity choices.

ADLINK said it will make Express-PTL and COM-HPC-mPTL development kits available in Q2 2026. It said the kits include reference carriers and full I/O support.

"Following the release of the Express-PTL, expect the unexpected as the COM-HPC-mPTL, SBC35-PTL, and MXE-330 expand the embedded solutions portfolio with compact and high-performance solutions designed for space-constrained, robotics, and AMR-class edge applications."