Adlink unveils rugged Intel Core Ultra edge AI modules

Adlink has introduced its first COM Express module based on Intel's Core Ultra 9 processors, positioning the new board for edge AI and embedded systems that require higher graphics and AI throughput alongside extended temperature resilience.

The new Express-PTL family uses Intel Core Ultra Series 3 processors, also known as Panther Lake H-series. It supports up to 16 CPU cores and integrates Intel's latest Xe3 graphics along with an NPU 5.0 engine aimed at AI inference at the edge.

Adlink said the module's NPU delivers up to 50 TOPS of dedicated AI processing. The integrated Xe3 GPU is specified at up to 120 TOPS for AI-related computation and includes up to 12 graphics engines. The company is targeting workloads such as computer vision, robotics and graphics-intensive embedded systems.

The Express-PTL is a COM Express Type 6 module. It marks a shift for Adlink towards Intel's new AI-focused client architecture in the embedded and industrial computing segment, where COM Express remains a widely adopted standard for modular designs.

Hybrid CPU design

The platform adopts Intel's hybrid CPU layout with four performance cores, eight efficiency cores and four low-power efficiency cores. Adlink positions this core mix for applications that need both peak performance and sustained operation within power and thermal limits at the edge.

The module supports up to 128 GB of DDR5 SO-DIMM memory. Adlink includes in-band error correction (IBECC) for memory, which targets applications that require higher reliability under continuous load or harsh conditions.

Industrial-temperature variants of the Express-PTL are rated for operation between -40°C and 85°C. Adlink is aiming those versions at outdoor systems, industrial automation and other deployments that see large temperature swings or shock and vibration.

The industrial SKUs add time-sensitive networking Ethernet support and other determinism and safety-oriented features. Adlink highlights support for time co-ordinated computing, functional safety-related frameworks and extended temperature components.

Graphics and edge AI

Adlink is positioning the Express-PTL for graphics-heavy applications such as medical imaging, infotainment systems and visual inspection. The company said the Xe3-based integrated GPU offers higher graphics throughput while allowing designers to use a simpler board layout than discrete GPU cards.

The module's focus on AI and graphics also targets emerging robotic systems, including humanoid and quadruped platforms. Adlink points to navigation, object recognition and real-time decision-making as likely use cases that rely on both the NPU and GPU resources.

The platform provides higher bandwidth PCI Express connectivity for external accelerators or peripherals. Adlink said this design enables lower-latency interaction between the CPU complex and attached AI or motion-control hardware in robotics and industrial systems.

Adlink describes the Express-PTL as suitable for both general embedded computing and AI-specific deployments. The combination of integrated GPU, NPU and extended-temperature design places the product in competition with other AI-focused system-on-module offerings that target vision, automation and transportation projects.

Rugged and compact follow-on

Alongside the COM Express range, Adlink plans a follow-on module based on the same Intel Core Ultra Series 3 processors in the COM-HPC Mini form factor. The upcoming COM-HPC-mPTL will measure 95 mm by 70 mm, which is smaller than traditional COM Express boards and is aimed at space-constrained designs.

Adlink said the COM-HPC-mPTL will integrate CPU, NPU and GPU functions with soldered-down memory. This layout is intended for systems that face constant vibration, shock or exposure to extreme temperatures, such as autonomous machines or defence-related platforms.

The COM-HPC-mPTL is scheduled for availability in the second quarter of 2026. Adlink plans to extend its embedded portfolio around this form factor for compact AI systems at the edge.

Development kits for both Express-PTL and COM-HPC-mPTL are also planned. Adlink said they will include reference carrier boards and full input/output support so that customers can start prototyping ahead of final deployment.

The company is seeking to align the release of these modules with the expected roll-out of Intel's Panther Lake-based platforms in embedded markets. Adlink expects the COM-HPC-mPTL kits and boards in particular to address demand for small, rugged AI systems in sectors such as robotics, industrial control and smart transport.